• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: A base of a plastic package and fabrication method thereof is to accomplish a miniaturizing technique such as leadless or bottom lead and various functional capabilities such as low noise or high heat radiation to a plastic package using a plastic molding technique. CONSTITUTION: A base of a plastic package comprises: a first lead frame including at least one unit body having a first pad(120) for chip bonding and a first lead(110a) arranged around the first pad and functioning as inner terminal apart from the first pad; a second lead frame including at least one unit body having a second pad(220) corresponding to the first pad and a second lead(210) corresponding to the first lead, the second pad and the second lead being attached to the rear surface of the first pad and the first lead; and a plastic body(320) exposing the front surfaces of the first lead and the first pad and the rear surface of the second lead and the second pad and molded between the first lead frame and the second lead frame such that the plastic body is not protruded upward from the front surface of the first lead.
    公开号:KR20000059243A
    申请号:KR1020000042755
    申请日:2000-07-25
    公开日:2000-10-05
    发明作者:박찬익
    申请人:박찬익；
    IPC主号:
    专利说明:

    Base of plastic package and method of manufacturing the same
    The present invention relates to a package containing a semiconductor chip, and more particularly to a base of a plastic package and a manufacturing method thereof.
    The electric and electronic device package including the semiconductor is divided into a ceramic package and a plastic package according to the material. The ceramic package is of the air cavity type which forms an empty space filled with air in the package such that there is no contact of the package material on the active surface of the electric and electronic device chip, but the plastic package is usually not the air cavity type. The air cavity type package is a device that requires physically fragile devices, electrically sensitive high frequency devices, surface acoustic wave filter elements, and transparent windows, in which electrical and electronic device chips have serious obstacles due to contact with package materials. It is essential for devices, imaging devices, and the like. However, the ceramic package is relatively expensive, and the packaging operation efficiency is not suitable for mass production.
    In recent years, an air cavity-type plastic package has been developed by using a plastic material that replaces the ceramic package and accommodates the productivity and economy of the conventional plastic package. This is accelerating the development of air cavity-type plastic sealing technology based on the relaxed reliability conditions as the related advanced technologies developed for military use in the past are commercialized for civilian use.
    In addition to the fundamental differentiation factor of the air cavity type compared to the conventional plastic package, the ceramic package has a distinctive merit in terms of functionality such as low noise and high heat dissipation design. This is an inherent advantage of ceramic packages, which is why recent air-cavity plastic packages do not replace ceramic packages more widely. That is, until recently, the air cavity-type plastic package technology has a problem in that it is almost impossible to design excellent functionality like a ceramic package, or even if it is possible, the advantages of inherent productivity and economy are faded.
    The conventional plastic package is a post-molded package in that the plastic body is molded after the chip is placed on the lead frame. On the other hand, the air cavity type plastic package is a pre-linear package in which the plastic body is preformed on the lead frame and then the chip is seated. The package is called the plastic base and the cover before the packaging process such as seating the chip and wire bonding. The main components of the system should be prepared. Then, the cover is attached to the package base containing the chip with an epoxy adhesive to form an air cavity to block the access of air.
    Air cavity plastic packages have been developed into two major categories, depending on the type of plastic and adhesive. Injection molding the base and the lid with a thermoplastic resin and sealing with a non-stage epoxy, transfer molding the base and the lid with a thermosetting resin and using an A-stage epoxy as the sealant. The latter case is currently evaluated to show excellent excellence in productivity and reliability.
    The functionality of an air cavity package is generally expressed at the package base. In general, a metal ground plate as a heat sink is attached to achieve a high heat dissipation effect, and the leads are spaced apart at regular intervals from the ground plate to achieve low noise performance. 1 is a cross-sectional view showing a conventional air cavity-type plastic package.
    Referring to FIG. 1, as a base of an air cavity package, a plastic body 14 is formed on the upper, lower, and side surfaces of the lead frame 12 as a wall of the air cavity, and an adhesive 16 is formed on the bottom thereof. The heat sink 10 is attached. In addition, the chip 18 is bonded on the heat sink 10, the chip 18 is wire bonded by the lead frame 12 and the bonding wire 22, the heat sink 10 by the ground wire 24 ) The cover 20 is adhered to the base by the adhesive 16. Thus, a package in which an air cavity is formed around the chip 18 is completed.
    However, a package formed in the above manner has many problems. That is, in the process of forming the wall of the air cavity from plastic or post-treatment, the mold flash is not easily suppressed and removed, so that contamination defects caused by the mold flash are generated. In addition, in the process of interposing the adhesive for attaching the heat sink 10, the airtightness of the adhesive surface is greatly impaired even in the difference in the amount of the adhesive, which is not reproducible and greatly impairs the safety of quality.
    These problems may be understood in more detail by the following description. As a method of suppressing the mold flash on the lead frame in the molding process, a method of strongly pressing the lead frame with the upper and lower dies of the mold is most effective. The process of forming the cavity wall is impossible. In addition, complete removal of the mold flash that is already generated is not easy, even though a complicated process of dissolving with chemicals and applying pressure with water is removed. In order to miniaturize the package, the cavity wall should be formed as narrow as possible, and the amount of the adhesive interposed therein for attaching the heat sink should be applied in such a small amount. The adhesive uses a high viscosity liquid epoxy that is relatively adhesive with a metal heat sink. It is very difficult to reproducibly apply a fine amount of high viscosity liquid epoxy, and even the slightest amount bleeds into the effective area of the heat sink, which impedes the bonding of the ground wire 24 between the chip and the heat sink, and even the smallest amount is The airtightness of the adhesive surface of the metal heat sink can be greatly influenced and the quality becomes unstable.
    2 is a cross-sectional view showing another conventional air cavity-type plastic package. Referring to FIG. 2, as a base of an air cavity-type package, a part of the upper, lower and side surfaces of the first lead frame 42 having a pad capable of bonding the chip 48 at the center thereof is provided as a wall of the air cavity. The first plastic body 44b is molded, and a second lead frame 40 having a lead as an external terminal and a heat dissipation plate is attached to the bottom of the first plastic body 44b by a conductive welding agent. ) To form a complete shape. In addition, a chip 48 is bonded on the center pad of the first lead frame 42, and the chip 48 is wired by a lead and a bonding wire 52 formed outside the first lead frame 42. Bonded The cover 50 is adhere | attached on the base by the adhesive agent 46. Thus, a package in which an air cavity is formed around the chip 48 is completed.
    The package is formed of a first inner wall of the cavity formed by compressing most of the first lead frame 42 with the upper and lower dies of the mold, and having a heat sink and a lead on the bottom thereof. The second lead frame 40 is attached with a conductive welding agent and molded again to form a cavity outer wall with the second plastic body 44a. However, even if the package improves the disadvantages of the prior art as shown in FIG. 1, the molding wall is thickened by two moldings, which is disadvantageous in miniaturization of the package, and the adhesion between the primary and secondary molding surfaces is weak. There are disadvantages that the number of molds is increased and complicated, which leads to an excessive development cost burden.
    The present invention has been made to solve the above problems, and an object of the present invention is to use a plastic molding technique, such as a leadless or bottom lead, such as a leadless or bottom lead, of a ceramic package, The present invention provides a plastic package base and a method of manufacturing the same that can realize various functional structures for high heat dissipation.
    Another object of the present invention is to provide a plastic package base having a simple process, improved productivity, and excellent cost reduction effect, and a method of manufacturing the same.
    1 is a cross-sectional view showing a conventional air cavity-type plastic package.
    2 is a cross-sectional view showing another conventional air cavity-type plastic package.
    3 is a cross-sectional view showing an air cavity-type plastic package according to an embodiment of the present invention.
    4 is a cross-sectional view showing an air cavity-type plastic package according to another embodiment of the present invention.
    5 is a perspective view illustrating a first lead frame applied to an embodiment of the present invention.
    5A to 5D are perspective views illustrating various modifications of a unit of a first lead frame applied to an embodiment of the present invention.
    6 is a perspective view illustrating a second lead frame applied to an embodiment of the present invention.
    FIG. 7A is a perspective view illustrating coupling of units of first and second lead frames according to an exemplary embodiment of the present invention. FIG.
    FIG. 7B is a bottom perspective view of FIG. 7A. FIG.
    8 is a perspective view illustrating a punching part of the first lead frame from FIG. 7B.
    FIG. 9A is a perspective view illustrating the completed assembly of the first and second lead frames after removing the punching portion of the first lead frame in FIG. 7A. FIG.
    9B is a bottom perspective view of FIG. 9A.
    10 is a perspective view showing a base of a plastic package according to an embodiment of the present invention.
    11 is a partial cutaway perspective view of an air cavity-type plastic package according to an embodiment of the present invention.
    12 is a perspective view separately showing corresponding first and second lead frames and respective units thereof according to another embodiment of the present invention.
    13 is a perspective view showing a base of a plastic package according to another embodiment of the present invention.
    14 is a partial cutaway perspective view of an air cavity-type plastic package according to another embodiment of the present invention.
    ※ Explanation of codes for main parts of drawing
    10, 40; Heat sinks 12, 40, 42; Lead frame
    14, 44a, 44b, 320; Plastic bodies 16, 46, 504; glue
    18, 48, 502; Chip 20, 50, 400; cover
    22, 52, 503; Bonding wires 24; Ground wire
    100; First lead frame 200; 2nd lead frame
    101, 201; Frame borders 102, 202; Section bar
    110a to 110e; First lead 112; Lead connection
    120; First pad 121; Pad border
    130a to 130e; First monomer 131; Pad connection
    210; Second lead 220; Second pad
    230, 230e; Second monomer 300; Base
    310; Welding agent 320; Plastic body
    500; package
    Plastic package base according to the present invention for achieving the above object, the first pad for chip bonding and at least one first unit including a first lead including a first lead as an inner terminal spaced apart from the first pad around the At least one or more second units each bonded to a bottom surface of the first lead frame, the first pad and the first lead of the first lead frame, and including a second pad and a second lead as an external terminal. And a second lead frame including the second lead frame and exposing an upper surface of the first lead and the first pad and a bottom surface of the second lead and the second pad, so as not to protrude upward from at least the upper surface of the first lead. And a plastic body molded between the first and second lead frames.
    An upper surface of the first lead and the first pad of the first lead frame and an upper surface of the plastic body may be coplanar, and an upper surface of the first lead and the plastic body of the first lead frame may be coplanar. It may be located higher than the upper surface of the first pad. In this case, the first lead of the first lead frame is bent in a step shape, the outer side of the first lead is bonded to the second lead, and the inner side of the first lead is interposed between the second pad and the plastic body. It is preferable that it is configured to overlap.
    In addition, the method for manufacturing a plastic package base according to the present invention for achieving the object of the present invention, at least a first unit including a first pad and a first lead as an inner terminal connected to the first pad in the periphery thereof; Preparing at least one first lead frame, at least one second pad including a first pad of the first lead frame, a second pad corresponding to the first lead, and a second lead as an external terminal; Preparing a second lead frame including: adhering the first lead frame and the second lead frame such that the first lead, the second lead, the first pad, and the second pad correspond to each other; By removing unnecessary connections of the first lead frame with respect to the first and second lead frames, the electrical and physical functionality as a package Includes forming a plastic body by performing a predetermined molded against the steps and combination of the flame leads to complete a bonded object of a single lead frame.
    The plastic body may be formed by bonding the chip on the assembly of the lead frame to form the entire package, preferably the top surface of the first lead and the first pad and the bottom surface of the second lead and the second pad. While exposing, it is formed so as not to protrude upward from at least the upper surface of the first lead.
    The first lead frame may include a plurality of first units including the first lead and the first pad in a predetermined arrangement in a frame array of the lead frame in a predetermined arrangement by a section bar, and the first pad of the first unit frame. Is connected to the section bar or the frame rim by a pad connection part, and the first lead of the first unit is formed to be distinguished by a predetermined space along the inner side of the edge of the first pad. That is, the tooth pads face the inner side of the extended pad edge of the first pad toward the connection portion, or the first lead has a shape that is isolated in an island shape in the first pad, and the first lead is formed by a separate lead connection portion. The shape may be connected to the first pad, or may be formed to be stepped by bending the middle of the first lead.
    After forming the plastic body, the method may further include polishing an upper surface of the first lead to remove the mold flash generated in the forming step, and for wire bonding the upper surface of the exposed first lead. And plating the chip on the first pad, performing wire bonding for electrical connection between the first lead and the chip, and wire bonding the chip after the plating step. Bonding the cover to form an air cavity on the plastic body and can be kept airtight.
    According to the present invention, the process is simplified because a single molding process is performed on the combination of the first lead frame and the second lead frame, and the mold flash is generated because the plastic body is not formed above the upper surface of the first lead frame. This is reduced, and even if a mold flash occurs, it can be easily removed by the polishing process.
    Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present embodiments are not intended to limit the present invention, but are merely illustrated to easily understand the spirit of the present invention as specific embodiments of the present invention, and vary within the spirit of the present invention as claimed in the appended claims. Of course, it can be modified.
    3 is a cross-sectional view showing an air cavity-type plastic package according to an embodiment of the present invention.
    Referring to FIG. 3, a first lead frame including a first lead 110a and a first pad 120 serving as an internal terminal, a second lead 210 and a second pad serving as an external terminal are provided. The second lead frame including 220 is bonded by a conductive welder 310 so as to overlap twice. The chip 520 is bonded by an adhesive (not shown) on the first pad 120 of the first lead frame, and the first lead 110a of the first lead frame serves as an internal terminal with the chip 520. Is wire bonded by the bonding wire 503.
    The first lead frame and the second lead frame are molded, for example, by the EMC plastic body 320, the upper surface of the first lead 110a and the first pad 120, and the second lead 210. And the bottom of the second pad 220 is exposed. In addition, an upper surface of the plastic body 320, an upper surface of the first lead 110a, and an upper surface of the first pad 120 form the same plane.
    The cover 400 is adhered on the base of the package in which the first lead frame and the second lead frame are coupled by the plastic body 320 via an epoxy adhesive 504 to maintain airtightness. Thus, a plastic package in which an air cavity is formed between the base of the package and the cover 400 is constructed.
    4 is a cross-sectional view showing an air cavity-type plastic package according to another embodiment of the present invention. The same members as those in the embodiment shown in FIG. 3 use the same reference numerals, and a detailed description thereof will be omitted.
    Referring to FIG. 4, the first lead 110d of the first lead frame is bent in a step shape, and the upper surface of the plastic body 320 and the upper surface of the first lead 110d form the same plane. It is formed higher than the upper surface of the first pad 120. That is, the outer side of the first lead 110d is adhered to the upper surface of the second lead 210, and the inner side of the first lead 110d has an edge portion and a predetermined portion of the plastic body 320. ) And are nested.
    Next, package bases of a plastic package for an air cavity type electronic and electronic device according to an embodiment of the present invention and a method of manufacturing the same will be described.
    First, a first lead frame and a second lead frame, which can overlap each other and are bonded, are prepared. 5A is a perspective view illustrating a first lead frame applied to an embodiment of the present invention. 5B to 5D are perspective views illustrating various modifications of a unit of a first lead frame applied to an embodiment of the present invention. FIG. 6 is a perspective view illustrating a second lead frame prepared to be correlated with the first lead frame of FIG. 5A.
    As shown in FIG. 5A, the first lead frame 100 is formed of a first lead 110a and a first space separated by a predetermined space in the frame frame 101 without a lead portion divided into an external lead in a general lead frame. A plurality of first units 130a formed of one pad 120 are divided into section bars 102 and arranged in a plurality of arrangements. In the first unit body 130a, the first lead 110a is included inside the edge of the first pad 120 and is fixed to the pad edge 121 with the smallest possible connection. The first pad 120 ) Is fixed to the frame rim 101 of the section bar 102 or the lead frame by the minimum possible pad connection 131.
    Here, the unit composed of the first lead and the first pad may be configured in various forms. As shown in an enlarged view in FIG. 5A, the first pad 120 is connected to the pad rim 121 formed along the edge of the first unit body 130a, and chip bonding of the first pad 120 occurs. The most basic form is that the first leads 110a connected to the pad rim 121 around the inner part are arranged in the shape of teeth facing the inner part of the first pad 120.
    On the contrary, as shown in the unit body 130b shown in FIG. 5B to improve the low noise effect, the first pad 110 may be adjacent to the inner side of the first lead 110b and the first pad 120 over a large area possible. Independently connected to the pad rim 121 of the 120 to form a saw tooth shape engaging the first lead 110b and the first pad 120, or as shown in the unit 130c shown in Figure 5c, The first lead 110c may be provided as a mold station that is isolated from the first pad 120 in an island form and is fixed to the first pad 120 by a separate lead connecting unit 112.
    In addition, as illustrated in the unit body 130d illustrated in FIG. 5D, unlike the first lead 110a of the first unit body 130a illustrated in FIG. 5A, the first lead 110d is bent in a stepped shape. It can be configured as. This extends the second pad 220 of the second lead frame 200, which will be described later with reference to FIG. 6, and overlaps the first lead 110d so as to further increase the heat dissipation effect and the low noise effect. The inner end of 110d) is bent so as to be stepped higher than the second pad 220. Although not shown in the drawings, it is a matter of course that each of the first leads of FIGS. 5A to 5C can be bent in a step shape in the middle to have a step.
    As shown in FIG. 6, the second lead frame 200 has a section bar 202 in the entire frame rim 201 to include a second unit 230 including a second lead 210 and a second pad 220. ) And a plurality of the second lead 210 to correspond to the first lead frame 100, the second lead 210 and the first pad 110a and the second pad 220 is as large as possible with the first pad 120 The second lead 210, the first pad 120, the second pad 220, and the first lead 110a may be spaced apart from each other at a predetermined interval unless they are grounded.
    Next, the first lead frame 100 illustrated in FIG. 5A and the second lead frame 200 illustrated in FIG. 6 are attached to each other with a conductive welding agent 310. FIG. 7A is a perspective view illustrating a combination of the first unit 130 and the second unit 230 in a combined body of the first and second lead frames 100 and 200, and FIG. 7B is a bottom perspective view of FIG. 7A. .
    7A and 7B, the first unit 130 of the first lead frame 100 and the second unit 230 of the second lead frame 200 are adhered to each other by the conductive welding agent 310. At this time, the bottom surface of the first pad 120 and the top surface of the second pad 220 are bonded to each other, and the bottom surface of the first lead 110a and the top surface of the second lead 210 are electrically and physically functional with each other. Correspondingly bonded so that a connection is made to have.
    Subsequently, unnecessary elements of the first lead frame 100 are punched out and removed. FIG. 8 is a perspective view illustrating a punching area of the first lead frame 100 from FIG. 7B. Referring to FIG. 8, unnecessary elements excluding the first pad 120 and the first lead 110a from the first lead frame 100, that is, the pad rim 121, the lead connecting portion 111, and the pad connecting portion 131. Punch them and remove them.
    As a result, the two lead frames are a single lead frame that is electrically and physically functional in a package, and are formed of a lead frame assembly in a form capable of an effective electronically molded molding. FIG. 9A is a perspective view illustrating the completed assembly of the first and second lead frames after removing the punching portion of the first lead frame in FIG. 7A, and FIG. 9B is a bottom perspective view of FIG. 9A.
    Subsequently, a plastic mold molding process is performed on the combination of the first and second lead frames to form the base 300 of the plastic package. 10 is a perspective view showing a base 300 of a plastic package according to an embodiment of the present invention.
    Referring to FIG. 10, the plastic body 320 is formed without division of each unit over the entire thickness of the lead frame assembly and at least the area extending from the entire edge of the second lead frame 200. In this case, the entire upper surface of the first lead 110a, the upper surface of the first pad 120, and the entire bottom surface of the second lead frame are exposed. 10 shows that the plastic body 320 is formed to be flush with the upper surface of the first lead 110a and the upper surface of the first pad 120. In this case, when the first lead frame having the first unit illustrated in FIG. 5C is used, the first pad may be formed lower than the surface of the plastic body as illustrated in FIG. 4.
    On the other hand, when the mold flash is smeared onto the exposed metal surface of the lead frame, the mold flash is simply removed by a mechanical polishing process such as rubbing the flat surface.
    Subsequently, after molding the plastic body 320, all metal surfaces exposed to the outside of the plastic body 320 are subjected to an air cavity-type plastic package by performing chip 502 bonding, wire 503 bonding, and effective plating on board mounting. Finish and finish the base 300 of 500.
    Subsequently, a subsequent process is performed on the base 300 of the completed plastic package to complete formation of the package. 11 is a partial cutaway perspective view of an air cavity-type plastic package 500 according to an embodiment of the present invention.
    Referring to FIG. 11, the completed package base 300 is cut into individual units by a saw through a sealing process of covering the cover 400 using chip bonding, wire bonding, and epoxy adhesive 504. Then, the assembly is completed in a leadless type air cavity plastic package 500 as shown in FIG.
    On the other hand, the molding of the body 320 of the package base 300 may be performed for each unit, and the final assembled package according to this is a bottom lead type (bottom lead type) that is individualized by cutting the second lead 210. It becomes a package.
    12 is a perspective view separately showing corresponding first and second lead frames and respective units thereof according to another embodiment of the present invention, and FIG. 13 is a plastic package manufactured by molding a combination of the lead frames of FIG. 12. FIG. 14 is a perspective view illustrating a partially cutaway view of an air cavity-type plastic package manufactured by applying the base of FIG. 13.
    12, 13, and 14, a first lead frame 100e and a second lead frame 200e prepared correspondingly are prepared. The first unit body 130e of the first lead frame 100e and the second unit body 230e of the second lead frame 200e are respectively enlarged, and the first unit body 130e has a first pad (in the center). The first leads 110e are separated from each other independently in an island shape with respect to the 120, and the second leads 230e have the second leads 210 arranged around the second pad 220 in the center thereof. The second leads 210 have a half etched surface 211 from which a portion of the upper side is removed. The half etched surface 211 is formed in most of the second leads 210 except for the connection portion with the first lead 110e isolated in an island shape in the first lead frame 100e.
    Subsequently, as illustrated in FIG. 13, the plastic body 320 is formed without division of each unit over the entire thickness of the lead frame assembly and at least the entire area of the second lead frame 200e. In this case, the entire upper surface of the first lead 110e, the entire upper surface of the first pad 120, and the entire bottom surface of the second lead frame are exposed. FIG. 13 shows that the plastic body 320 is formed to be flush with the upper surface of the first lead 110e and the upper surface of the first pad 120. In this case, when the first lead frame having the first unit illustrated in FIG. 5C is used, the first pad may be formed lower than the surface of the plastic body as illustrated in FIG. 4.
    On the other hand, when the mold flash is smeared onto the exposed metal surface of the lead frame, the mold flash is simply removed by a mechanical polishing process such as rubbing the flat surface. Subsequently, by molding the plastic body 320 after molding, all metal surfaces exposed out of the plastic body 320 are subjected to chip 502 bonding, wire 503 bonding and plating treatment effective for board mounting, for example, copper. The base 300e of the air cavity-type plastic package 500 is completed and finished.
    Subsequently, a subsequent process is performed on the base 300e of the completed plastic package to complete formation of the package. 14 is a partially cutaway perspective view of an air cavity-type plastic package 500e according to an embodiment of the present invention.
    On the other hand, the present invention is not limited to the above embodiment and can be practiced by adding many modifications without departing from the scope of the present invention. For example, when the body is molded in a form in which the second pad is removed, or when the first lead is arranged in an island form, the air is covered by a metal cover with a conductive adhesive or welding agent interposed inside the edge of the first pad for shielding electromagnetic waves. Such is the case when the cavity is closed.
    In addition, although the plastic mold molding may be performed on the entire assembly of the lead frame to form the base of the package, the mold molding may be performed on each unit separately, unlike the present embodiment, three or more lead frames After lamination, the single lead frame assembly may be completed by adhering with a conductive welding agent and removing and removing unnecessary elements.
    In addition, after completing the plastic package base of the present invention, the package may be assembled by forming a cover for forming the air cavity for the air cavity-type package, but after the chip bonding may be completed by a single mold molding package, of course to be.
    According to the present invention, first, the heat dissipation effect is greatly improved by increasing the thickness and area of the metal as the heat sink by the first pad and the second pad.
    Second, the flat structure of the entire package base facilitates suppression and removal of mold flash, thereby simplifying the manufacturing process and improving productivity and reducing costs.
    Third, a low noise design can be easily implemented by capturing the first lead to the largest area inside the edge of the first pad or overlapping the second pad.
    Fourth, as a plastic package, a leadless or bottom lead structure can be easily realized to reduce the area to be mounted on an actual circuit board, thereby achieving a miniaturization effect.
    Fifth, since two or more lead frames are stacked and connected, they can be punched out to create a single lead frame assembly having electrical and physical functionality as a package, thereby easily achieving impossible electrical wiring and processing with only one lead frame.
    权利要求:
    Claims (7)
    [1" claim-type="Currently amended] A first lead frame including at least one first unit including a first pad for chip bonding and a first lead as an inner terminal spaced apart from the first pad, and a first pad for chip bonding;
    A second lead frame having at least one second unit body adhered to the first pad and the first lead of the first lead frame, respectively, and having at least one second unit including a second pad and a second lead as an external terminal; ; And
    Between the first and second lead frames while exposing the top surface of the first lead and the first pad and the bottom surface of the second lead and the second pad, so as not to protrude upward from at least the top surface of the first lead. A plastic package base comprising a molded plastic body.
    [2" claim-type="Currently amended] The plastic package base of claim 1, wherein an upper surface of the first lead and the first pad of the first lead frame and an upper surface of the plastic body are coplanar.
    [3" claim-type="Currently amended] The plastic package base of claim 1, wherein the first lead of the first lead frame and the top surface of the plastic body are coplanar and positioned higher than the top surface of the first pad.
    [4" claim-type="Currently amended] 4. The method of claim 3, wherein the first lead of the first lead frame is bent in a step shape, the outer side of the first lead is bonded to the second lead, and the inner side of the first lead is connected to the second pad. Plastic package base, characterized in that configured to overlap via a plastic body.
    [5" claim-type="Currently amended] Preparing a first lead frame including at least one first unit including a first pad and a first lead connected to the first pad as an internal terminal connected to the first pad;
    Preparing a second lead frame including at least one second unit including a first pad of the first lead frame, a second pad corresponding to the first lead, and a second lead as an external terminal;
    Bonding the first lead frame and the second lead frame such that the first lead and the second lead and the first pad and the second pad are connected in correspondence with each other;
    Removing unnecessary connections of the first lead frame with respect to the connected first and second lead frames to complete an assembly of a single lead frame having electrical and physical functionality as a package; And
    And forming a plastic body by performing a predetermined mold molding on the assembly of the lead frames.
    [6" claim-type="Currently amended] 6. The plastic body of claim 5, wherein the plastic body is formed so as not to protrude upward from at least the top surface of the first lead while exposing the top surface of the first lead and the first pad and the bottom surface of the second lead and the second pad. Method for producing a plastic package base, characterized in that.
    [7" claim-type="Currently amended] According to claim 5, The first lead frame, A plurality of the first unit having the first lead and the first pad in the frame border of the lead frame is arranged in a plurality of arrangement in a predetermined arrangement by the section bar, the first unit The first pad of the first unit is connected to the section bar or the frame rim by a pad connecting portion, and the first lead of the first unit is formed to be distinguished by a predetermined space inside the edge of the first pad. Method for producing a plastic package base.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2000-07-25|Application filed by 박찬익
    2000-07-25|Priority to KR1020000042755A
    2000-07-25|Priority claimed from KR1020000042755A
    2000-10-05|Publication of KR20000059243A
    2001-07-20|Priority claimed from AU7281401A
    2002-05-06|Application granted
    2002-05-06|Publication of KR100335658B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020000042755A|KR100335658B1|2000-07-25|Base of plastic package and method of manufacturing the same|
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